Silicon Wafer
CAS #: 7440-21-3
Product Code : ESi-A557-CU-CU
CAS #: 7440-21-3
Linear Formula: Si
MDL Number: MFCD00085311
EC No.: 231-130-8
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Synonyms
646687, 647535, 647780, 647802, 647675, 647764, 647101, 647543, 647772, 647799, 647705
Molecular Weight: 28.08
Appearance: Silvery
Melting Point: 1414 °C
Boiling Point: 2900 °C
Density: 2330 kg/m3
Solubility in H2O: N/A
Poisson's Ratio: 0.064 - 0.28
Young's Modulus: 51-80 GPa
Vickers Hardness: N/A
Tensile Strength: N/A
Thermal Conductivity: 1.49 W/cm/K @ 298.2 K
Thermal Expansion: (25 °C) 2.6 µm·m-1·K-1
Electrical Resistivity: 3-4 microhm-cm @ 0 °C
Electronegativity: 1.8 Paulings
Specific Heat: 0.168 Cal/g/K @ 25 °C
Heat of Fusion: 9.47 Cal/gm mole
Heat of Vaporization: 40.6 K-Cal/gm atom at 2355 °C
Health & Safety Information
Signal Word: N/A
Hazard Statements: N/A
Hazard Codes: N/A
Precautionary Statements: P312
Flash Point: Not applicable
Risk Codes: N/A
Safety Statements: N/A
RTECS Number: VW0400000
Transport Information: NONH
WGK Germany: 2
Chemical Identifiers
Linear Formula: Si
Pubchem CID: 5461123
MDL Number: MFCD00085311
EC No.: 231-130-8
Beilstein/Reaxys No.: N/A
SMILES: [Si]
InchI Identifier: InChI=1S/Si
InchI Key: XUIMIQQOPSSXEZ-UHFFFAOYSA-N
