Platinum Wafer CAS #: 7440-06-4

Synonyms Platinum substrate

Molecular Weight: 195.08 Appearance: Gray Wafer Melting Point: 1772 °C Boiling Point: 3827   °C Density: 21.45 g/cm3 Solubility in H2O: N/A Poisson's Ratio: 0.38 Young's Modulus: 168 GPa Vickers Hardness: 549 MPa Tensile Strength: N/A Thermal Conductivity: 0.716 W/cm/K @ 298.2 K Thermal Expansion: (25 °C) 8.8 µm·m-1·K-1 Electrical Resistivity: 10.6 microhm-cm @ 20 °C Electronegativity: 2.2 Paulings Specific Heat: 0.0317 Cal/g/K @ 25 °C Heat of Vaporization: 122 K-Cal/gm atom at 3827 °C

Health & Safety Information Signal Word: Danger Hazard Statements: H260-H314-H318-H350 Hazard Codes: N/A Precautionary Statements: P201-P202-P223-P231 + P232-P260-P264-P280-P281-P301 + P330 + P331-P303 + P361 + P353-P304 + P340 + P310-P305 + P351 + P338 + P310-P308 + P313-P335 + P334-P363-P370 + P378-P402 + P404-P405-P501 Flash Point: Not applicable Risk Codes: N/A Safety Statements: N/A RTECS Number: N/A Transport Information: UN 2257 4.3 / PGI WGK Germany: 1 GHS Pictogram: Image,Image,Image

Chemical Identifiers Linear Formula: Pt Pubchem CID: 23939 MDL Number: MFCD00011179 EC No.: 231-116-1 Beilstein/Reaxys No.: N/A SMILES: [Pt] InchI Identifier: InChI=1S/Pt InchI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N