Titanium Silicon Nitride Sputtering Target,CAS : N/A

E FORU specializes in producing high purity Titanium Silicon Nitride Sputtering Target,CAS : N/A with the smallest possible average grain sizes,Purities may include 99%, 99.9%, 99.99%, 99.999% and 99.9999%, which are sometimes referred to as 2N, 3N, 4N, 5N and 6N. 99.99995% (6N5), and in some cases up to 99.99999% (7N) and 99.999999% (8N),Our standard powder particle sizes average in the range of - 325 mesh, - 200 mesh,- 100 mesh, 10-50 microns and submicron ( 148 micron). We can also provide in the nanoscale range.Powders are also useful in any application where high surface areas are desired such as water treatment and in fuel cell and solar applications. Nanoparticles also produce very high surface areas.Production of metallic carbide materials including boron Nitride, cobalt Nitride, chromium Nitride, hafnium Nitride, molybdenum Nitride, niobium Nitride, tantalum Nitride, titanium Nitride, vanadium Nitride, zirconium Nitride, and numerous others.Nitrides are any of a class of chemical compounds in which nitrogen is combined with an element of similar or lower electronegativity, such as boron, silicon, and most metals. Certain metal nitrides are unstable, and most react with water to form ammonia and the oxide or hydroxide of the metal; but the nitrides of boron, vanadium, silicon, titanium, and tantalum are very refractory, resistant to chemical attack, and hardQuality inspection department staff which uses atomic spectroscopy, x-ray diffraction analysis, scanning electron microscopy, glow discharge mass spectroscopy (GDMS), and BET surface area analysis, among other technologies, to ensure that the elemental composition and structural properties of each product rigorously adhere to our standards.