Alloy 52,Glass sealing 52 Alloy Plate,UNS N14052,E FORU

British Specs:，American Specs: ASTM F30，German Specs:

### **Alloy 52 (Glass Sealing 52) - Plate Product Overview** **Alloy 52** is a nickel-iron controlled expansion alloy specifically engineered for matched sealing with specific borosilicate hard glasses. The **Plate** form provides flat, dimensionally stable stock material for manufacturing components requiring precise thermal expansion compatibility with hard glass in various high-reliability applications. * **UNS Designation:** **N14052** * **Common Names:** Glass Sealing 52 Plate, 52Ni-Fe Alloy Plate --- #### **1. Chemical Composition** Precisely controlled chemistry ensures consistent thermal expansion properties in plate form. | Element | Percentage (%) | Role in the Alloy | |:---|:---|:---| | **Nickel (Ni)** | 51.0 - 52.5 | Controls CTE characteristics and Curie point | | **Iron (Fe)** | Balance | Base structural element | | **Manganese (Mn)** | 0.10 - 0.30 | Enhances hot rolling characteristics | | **Silicon (Si)** | 0.10 - 0.30 | Improves glass wetting and sealing performance | | **Carbon (C)** | 0.05 max | Limited for optimal machinability and stability | | **Sulfur (S)** | 0.02 max | Controlled impurity | | **Phosphorus (P)** | 0.02 max | Controlled impurity | --- #### **2. Physical Properties** Specialized properties optimized for plate applications and hard glass sealing. | Property | Value / Condition | Notes | |:---|:---|:---| | **Density** | 8.25 g/cm³ (0.298 lb/in³) | | | **Melting Point** | ~1435 °C (2615 °F) | | | **Thermal Expansion Coefficient** | 20-300°C: 9.8-10.5 μm/m·°C
20-400°C: 10.2-10.8 μm/m·°C | Matches specific borosilicate glass expansion | | **Curie Temperature** | ~500 °C (930 °F) | Critical for CTE matching with hard glasses | | **Thermal Conductivity** | 15.5 W/m·K at 20°C | | | **Electrical Resistivity** | 0.47 μΩ·m at 20°C | | | **Specific Heat** | 0.46 J/g·°C at 20°C | | --- #### **3. Mechanical Properties (Annealed Condition)** **Plate Mechanical Characteristics:** * **Tensile Strength:** 520-590 MPa (75-86 ksi) * **Yield Strength (0.2% Offset):** 280-350 MPa (41-51 ksi) * **Elongation:** 25-35% in 2 inches * **Hardness:** 68-83 HRB * **Modulus of Elasticity:** 156 GPa (22.6 × 10⁶ psi) * **Shear Strength:** 420 MPa (61 ksi) * **Fatigue Strength:** 250 MPa (36 ksi) at 10⁸ cycles --- #### **4. Product Specifications & Applications** **Plate Specifications:** * **Thickness Range:** 5.0 mm to 100 mm * **Width Range:** 200 mm to 1500 mm * **Length Range:** 1000 mm to 3000 mm * **Thickness Tolerance:** ±5% standard, ±3% available * **Flatness:** ≤3 mm per meter standard * **Surface Finish:** 3.2 μm Ra standard, 1.6 μm Ra available **Types Available:** * **Hot Rolled Plate:** For general applications * **Annealed Plate:** Stress-relieved for machining stability * **Pre-oxidized Plate:** Ready for immediate glass sealing * **Machined Plate:** Precision surface finished for critical applications **Primary Applications:** **Electronics & Electrical Applications:** * **Electronic Package Bases:** Substrates for hybrid circuits and power electronics * **Microwave Component Mounting:** Precise mounting plates for RF systems * **Vacuum Chamber Flanges:** Large sealing surfaces for vacuum systems * **Power Tube Headers:** Base plates for high-power electronic tubes **Industrial & Scientific Applications:** * **Optical Bench Components:** Stable mounting platforms for optical systems * **Laboratory Equipment Bases:** Precision reference surfaces * **Instrumentation Plates:** Stable bases for scientific instruments * **Laser System Components:** Mounting plates and structural elements **Aerospace & Defense:** * **Avionics Mounting Plates:** Stable platforms for aircraft electronics * **Satellite Component Bases:** Structural elements for space applications * **Military Electronics Housings:** Enclosure components for defense systems --- #### **5. International Standards** Comprehensive international specifications for plate products. | Standard Type | Standard Number | Title / Specification | |:---|:---|:---| | **ASTM** | **ASTM F15** | Standard Specification for Iron-Nickel Sealing Alloys | | **UNS** | **N14052** | Unified Numbering System Designation | | **AMS** | AMS 7723 | Aerospace Material Specification | | **ASTM** | ASTM B48 | Standard Specification for Nickel Alloy Plate | | **DIN** | DIN 1745 | Metallic Materials for Glass-to-Metal Seals | | **ISO** | ISO 9711 | Metallic Materials for Glass-to-Metal Seals | | **ASME** | SB-48 | Nickel Alloy Plate Specification | --- #### **6. Manufacturing & Processing** **Machining Characteristics:** * **Machinability Rating:** 40% (compared to free-cutting brass) * **Recommended Tools:** Carbide tools with positive rake angles * **Cutting Speed:** 25-40 m/min for milling operations * **Feed Rate:** 0.1-0.3 mm/tooth for milling * **Coolant Requirements:** Essential for optimal surface finish **Heat Treatment:** * **Annealing Temperature:** 850-900°C in protective atmosphere * **Stress Relieving:** 650-750°C after heavy machining * **Cooling Rate:** Controlled cooling ≤50°C per hour for thick plates **Glass Sealing Preparation:** * **Surface Preparation:** Critical cleaning and surface activation * **Flatness Control:** Essential for uniform glass sealing * **Surface Finish:** 0.8-3.2 μm Ra optimal for glass adherence * **Sealing Parameters:** 950-1050°C with controlled atmosphere --- #### **7. Quality Assurance** * **Chemical Certification:** Mill certificate with heat analysis * **Dimensional Verification:** Thickness, flatness, and dimensional checks * **Surface Quality:** Visual inspection and surface roughness measurement * **Ultrasonic Testing:** For internal quality assessment of thick plates * **Mechanical Testing:** Tensile and hardness testing per ASTM standards * **Flatness Verification:** Precision measurement across entire plate surface --- **Summary** **Alloy 52 (Glass Sealing 52) Plate (UNS N14052)** provides stable, flat stock material for manufacturing components requiring reliable hard glass-to-metal seals with specific borosilicate glasses. Its precisely matched thermal expansion properties, combined with excellent dimensional stability and machinability, make it essential for critical applications in electronics, aerospace, scientific instrumentation, and industrial equipment. The plate form enables the creation of large, stable sealing surfaces and structural components where maintaining precise dimensional relationships under thermal cycling is crucial. Compliance with **ASTM F15** and other international standards ensures material consistency and performance reliability for demanding applications across multiple high-technology industries.

Packing of Standard Packing: Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 2513 gallon liquid totes Special package is available on request.