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Alloy 475,Nilo 475 Wire,UNS K95000,E FORU

Product Code : NI-S910-CU-CU

Alloy 475,Nilo 475 Wire,UNS K95000, is available in Bar (Round bar, Flat bar), Ribbon, Wire, Rods, Tube, Pipe, Foil, Plate, Sheet, Strip and Forging Stock.

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Product Product Code Purity Size Contact Us
Alloy 475,Nilo 475 Wire,UNS K95000NI-S910-CU-CUCustomizedCustomized
British Specs:,American Specs:AMS 7718 Bar, Tube and Forgings MIL-N-14411 Comp 3,German Specs:
### **Alloy 475 (Nilo 475) - Wire Product Overview** **Alloy 475**, commercially known as **Nilo 475**, is a nickel-iron-cobalt controlled expansion alloy specifically engineered for matched sealing with special hard glasses and certain ceramic materials. The **Wire** form provides a versatile, continuous length product used primarily as lead-in wires and conductive paths through specialized glass envelopes in electronic components. * **UNS Designation:** **K95000** * **Common Forms:** Round Wire, Flat Wire, Bimetallic Composite Wire --- #### **1. Chemical Composition** Precisely controlled chemistry ensures consistent performance in wire drawing and specialized sealing processes. | Element | Percentage (%) | Role in Wire Form | |:---|:---|:---| | **Nickel (Ni)** | 46.0 - 48.0 | Controls thermal expansion characteristics | | **Cobalt (Co)** | 24.0 - 26.0 | Modifies thermal expansion properties | | **Iron (Fe)** | Balance | Provides structural integrity | | **Manganese (Mn)** | 0.10 - 0.30 | Enhances drawability and surface quality | | **Silicon (Si)** | 0.10 - 0.30 | Improves glass/ceramic wetting characteristics | | **Carbon (C)** | 0.05 max | Minimized for maximum ductility | | **Sulfur (S)** | 0.02 max | Controlled for wire drawing performance | | **Phosphorus (P)** | 0.02 max | Controlled for ductility | --- #### **2. Physical Properties** Optimized properties for wire processing and specialized sealing applications. | Property | Value / Condition | Notes | |:---|:---|:---| | **Density** | 8.35 g/cm³ (0.302 lb/in³) | Higher due to cobalt content | | **Melting Point** | ~1445 °C (2635 °F) | | | **Diameter Range** | 0.05 mm to 3.0 mm | Standard round wire | | **Thermal Expansion Coefficient** | 20-300°C: 7.8-8.5 μm/m·°C
20-400°C: 8.2-9.0 μm/m·°C | Unique CTE for special applications | | **Electrical Resistivity** | 0.52 μΩ·m at 20°C | | | **Curie Temperature** | ~420 °C (790 °F) | Modified by cobalt addition | | **Surface Finish** | 0.2-0.8 μm Ra | Optimized for material adherence | --- #### **3. Mechanical Properties** Properties vary with diameter and temper condition. | Diameter (mm) | Temper | Tensile Strength (MPa) | Elongation (%) | Notes | |:---|:---|:---|:---|:---| | 0.05-0.2 | Annealed | 500-570 | 15-25 | Fine wire | | 0.2-0.5 | Annealed | 520-590 | 20-30 | Standard lead wire | | 0.5-1.0 | Annealed | 530-600 | 25-35 | General purpose | | 1.0-3.0 | Annealed | 530-600 | 30-40 | Heavy duty | | All | Hard Drawn | 720-880 | 5-15 | For spring applications | --- #### **4. Product Forms & Specific Applications** **Wire Configurations:** * **Round Wire:** Standard diameters from 0.05 mm to 3.0 mm * **Flat Wire:** Rectangular cross-sections for specialized applications * **Bimetallic Wire:** Copper-clad for improved solderability * **Pre-oxidized Wire:** Ready for immediate glass/ceramic sealing * **Spool Packaging:** Various spool sizes from 100g to 25kg **Primary Applications:** * **Special Lead-in Wires:** Electrical conductors through unique glass envelopes * **Semiconductor Packages:** Internal lead frames for specialized applications * **Electronic Components:** Resistor, capacitor, and inductor lead wires * **Thermocouple Wires:** For high-temperature applications requiring special insulation * **Medical Devices:** Advanced implantable device leads and connections * **Aerospace Electronics:** Critical wiring in specialized avionics systems * **Glass-Sealed Feedthroughs:** Single and multi-pin configurations for special glasses --- #### **5. International Standards** Compliance with international wire and sealing alloy specifications. | Standard Type | Standard Number | Title / Specification | |:---|:---|:---| | **ASTM** | **ASTM F15** | Standard Specification for Iron-Nickel Sealing Alloys | | **UNS** | **K95000** | Unified Numbering System Designation | | **ASTM** | ASTM B258 | Standard Specification for Standard Nominal Diameters of Wire | | **IEC** | IEC 60404-8-6 | Metallic Magnetic Materials Specification | | **MIL-SPEC** | MIL-DTL-23488 | Sealing Alloy Requirements | | **DIN** | DIN 1745 | Metallic Materials for Glass-to-Metal Seals | | **ISO** | ISO 9711 | Glass-to-Metal Sealing Materials | --- #### **6. Manufacturing & Processing** **Wire Drawing Process:** * Multiple-pass drawing with intermediate annealing * Controlled reduction ratios for optimal grain structure * Final annealing in protective atmosphere * Precision spooling with tension control **Surface Treatments:** * **Copper Plating:** 0.5-2.0 μm thickness for improved solderability * **Nickel Plating:** For high-temperature applications * **Pre-oxidation:** Controlled oxide layer for immediate sealing * **Bright Annealing:** For critical surface-sensitive applications **Processing Guidelines:** * **Bending:** Good formability in annealed condition * **Welding:** Suitable for resistance, TIG, and laser welding * **Glass Sealing:** Optimal at 900-1000°C with controlled atmosphere * **Straightening:** Capable of precision straightening for automated assembly --- #### **7. Quality Assurance** * **Dimensional Control:** ±2% diameter tolerance standard, ±1% available * **Surface Quality:** 100% visual or automated inspection * **Mechanical Testing:** Regular tensile and elongation verification * **Metallurgical Quality:** Grain size control (ASTM 6-8 typical) * **Certification:** Full material traceability with test reports --- **Summary** **Alloy 475 (Nilo 475) Wire (UNS K95000)** provides a specialized connection solution for applications requiring reliable electrical conduction through special glass and ceramic seals. Its unique thermal expansion properties, enhanced by cobalt content, combined with good electrical characteristics and formability, make it suitable for specialized applications in lighting, electronics, aerospace, and medical device industries. The wire's ability to maintain hermetic integrity while providing electrical connectivity through specialized material envelopes establishes it as an important material in high-reliability electronic packaging and component manufacturing. Compliance with **ASTM F15** and other international standards ensures consistent quality and performance for both production and specialized custom applications requiring matched sealing with special glasses and ceramics.
Packing of Standard Packing: Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Solutions are packaged in polypropylene, plastic or glass jars up to palletized 2533 gallon liquid totes Special package is available on request.
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