Copper Metal CAS #: 7440-50-8

Synonyms Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Molecular Weight: 63.55 Appearance: Reddish Metal Melting Point: 1085 °C Boiling Point: 2562 °C Density: 8.96 g/cm3 Solubility in H2O: N/A Poisson's Ratio: 0.34 Young's Modulus: 110–128 GPa Vickers Hardness: 369 MPa Thermal Conductivity: 1.68 x 10-8&Ohm;·m Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1 Electrical Resistivity: 0.39 kJ/kg K Electronegativity: 1.90 Paulings Specific Heat: 0.39 kJ/kg K Heat of Fusion: 13.26 kJ ·mol-1 Heat of Vaporization: 300.4 kJ ·mol-1

Health & Safety Information Signal Word: N/A Hazard Statements: N/A Hazard Codes: N/A Precautionary Statements: N/A Risk Codes: N/A Safety Statements: N/A RTECS Number: GL5325000 Transport Information: NONH for all modes of transport WGK Germany: nwg

Chemical Identifiers Linear Formula: Cu Pubchem CID: 23978 MDL Number: MFCD00010965 EC No.: 231-159-6 IUPAC Name: copper Beilstein/Reaxys No.: N/A SMILES: [Cu] InchI Identifier: InChI=1S/Cu InchI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N