Ultra Thin Copper Nanoscale Foil
CAS #: 7440-50-8
Product Code : ECu-A739-CU-CU
CAS #: 7440-50-8
Linear Formula: Cu
MDL Number: MFCD00010965
EC No.: 231-159-6
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Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper
Molecular Weight: 63.55
Appearance: Reddish Metal
Melting Point: 1085 °C
Boiling Point: 2562 °C
Density: 8.96 g/cm3
Solubility in H2O: N/A
Poisson's Ratio: 0.34
Young's Modulus: 110–128 GPa
Vickers Hardness: 369 MPa
Thermal Conductivity: 401 W ·m-1 ·K-1
Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1
Electrical Resistivity: 1.673 μΩ-cm @ 20 °C
Electronegativity: 1.90 Paulings
Specific Heat: 0.39 kJ/kg K
Heat of Fusion: 13.26 kJ ·mol-1
Heat of Vaporization: 300.4 kJ ·mol-1
Health & Safety Information
Signal Word: Danger
Hazard Statements: H228-H400
Hazard Codes: F
Risk Codes: 11
Safety Statements: 16
RTECS Number: GL5325000
Transport Information: UN 3089 4.1/PG 2
WGK Germany: 3
Chemical Identifiers
Linear Formula: Cu
Pubchem CID: 23978
MDL Number: MFCD00010965
EC No.: 231-159-6
Beilstein/Reaxys No.: N/A
SMILES: [Cu]
InchI Identifier: InChI=1S/Cu
InchI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N