Tin Silver Copper Nanoparticles
CAS #: N/A
Product Code : ECu-A718-CU-CU
CAS #: N/A
Linear Formula: Sn/Ag/Cu
MDL Number: N/A
EC No.: N/A
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Synonyms
SnAgCu nanopowder, SAC, nano tin-silver-copper alloy nanoparticles, Sn–Ag–Cu nanosolder, lead-free solder, 96.5Sn3.0Ag0.5Cu, 95.7Sn3.6Ag0.7Cu, 95.5Sn4.0Ag0.5Cu, SAC305, SAC105, SAC0307, NC256
Compound Formula: AgCuSn
Molecular Weight: 290.124
Appearance: Gray powder or paste
Melting Point: 217 °C
Boiling Point: N/A
Density: N/A
Solubility in H2O: N/A
Exact Mass: 289.737 g/mol
Monoisotopic Mass: 289.737 g/mol
Health & Safety Information
Signal Word: N/A
Hazard Statements: H319-H335
Hazard Codes: Xi
Precautionary Statements: P261-P264-P304+P340-P05+P351+P338-P337+P313-P405-P501
Risk Codes: N/A
Safety Statements: N/A
Transport Information: N/A
GHS Pictogram: Image
Chemical Identifiers
Linear Formula: Sn/Ag/Cu
Pubchem CID: CTK2F6959
IUPAC Name: copper; silver; tin
SMILES: [Cu].[Ag].[Sn]
InchI Identifier: InChI=1S/Ag.Cu.Sn
InchI Key: PQIJHIWFHSVPMH-UHFFFAOYSA-N
