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Palladium Copper Sputtering Target CAS #: N/A

Product Code : ECu-A654-CU-CU

CAS #: N/A Linear Formula: Pd-Cu MDL Number: N/A EC No.: N/A

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Palladium Copper Sputtering TargetCAS #: N/AECu-A654-CU-CUCustomized
Synonyms Pd60Cu40, ASTM B685, CAS 12381-74-7), CAS 56780-39-3, CuPd2, CAS 186027-91-8, Cu2Pd3, CAS 78402-97-8, Cu6Pd4, CAS , CAS ,
Compound Formula: PdCu Appearance: Metallic target Melting Point: 1200 °C Boiling Point: N/A Density: 11.0 g/cm3 Solubility in H2O: N/A Monoisotopic Mass: 168.833 g/mol Poisson's Ratio: 0.37 Young's Modulus: 120 GPa Tensile Strength: 660-1150 MPa Thermal Expansion: 14.1 µm/m-K Specific Heat: 300 J/kg-K Heat of Fusion: 180 J/g
Health & Safety Information Signal Word: N/A Hazard Statements: N/A Hazard Codes: N/A Risk Codes: N/A Safety Statements: N/A Transport Information: NONH for all modes of transport
Chemical Identifiers Linear Formula: Pd-Cu Pubchem CID: 11378738 MDL Number: N/A EC No.: N/A IUPAC Name: copper; palladium SMILES: [Cu].[Pd] InchI Identifier: InChI=1S/Cu.Pd InchI Key: XPPWAISRWKKERW-UHFFFAOYSA-N
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