Molybdenum Copper Wafers
CAS #: N/A
Product Code : ECu-A633-CU-CU
CAS #: N/A
Linear Formula: MoCu
MDL Number: N/A
EC No.: N/A
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Synonyms
Mo-Cu, moly copper, CuMo, copper-clad molybdenum, 60/40 65/35 70/30 75/25 80/20 85/15, Molybdenum-Copper Composite Material, Copper-Molybdenum-Copper Laminate, CuMoCu, CMC, Cu/Mo70Cu/Cu, CPC, Copper, Compd. With Molybdenum (1:1), 135495-47-5
Compound Formula: MoCu
Molecular Weight: 159.496
Appearance: Metallic wafer
Melting Point: N/A
Boiling Point: N/A
Density: 9.6-10.0 g/cm3
Solubility in H2O: N/A
Exact Mass: 160.835 g/mol
Monoisotopic Mass: 160.835 g/mol
Tensile Strength: >e; 290 MPa (ultimate)
Thermal Conductivity: 165-215 W/m·K
Thermal Expansion: 6.8-9.5 µm/m-°C
Electrical Resistivity: 3.8 x 10-6Ω·cm
Health & Safety Information
Signal Word: N/A
Hazard Statements: N/A
Hazard Codes: N/A
Precautionary Statements: N/A
Risk Codes: N/A
Safety Statements: N/A
Transport Information: NONH for all modes of transport
Chemical Identifiers
Linear Formula: MoCu
Pubchem CID: 57448858
IUPAC Name: copper; molybdenum
SMILES: [Cu].[Mo]
InchI Identifier: InChI=1S/Cu.Mo
InchI Key: WUUZKBJEUBFVMV-UHFFFAOYSA-N
