Copper Lump CAS #: 7440-50-8

Synonyms Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Molecular Weight: 63.55 Appearance: Reddish Metal Melting Point: 1083.4 °C Boiling Point: 2567 °C Density: 8.96 g/cm3 Solubility in H2O: N/A Poisson's Ratio: 0.34 Young's Modulus: 110–128 GPa Vickers Hardness: 369 MPa Tensile Strength: N/A Thermal Conductivity: 4.01 W/cm/K @ 298.2 K Thermal Expansion: (25 °C) 16.5 µm·m-1·K-1 Electrical Resistivity: 1.678 microhm-cm @ 20 °C Electronegativity: 1.9 Paulings Specific Heat: 0.092 Cal/g/K @ 25 °C Heat of Fusion: 3.11 Cal/gm mole Heat of Vaporization: 72.8 K-cal/gm atom at 2567 °C

Health & Safety Information Signal Word: Danger Hazard Statements: H228-H400 Hazard Codes: F Risk Codes: 11 Safety Statements: 16 RTECS Number: GL5325000 Transport Information: UN 3089 4.1/PG 2 WGK Germany: 3

Chemical Identifiers Linear Formula: Cu Pubchem CID: 23978 MDL Number: MFCD00010965 EC No.: 231-159-6 Beilstein/Reaxys No.: N/A SMILES: [Cu] InchI Identifier: InChI=1S/Cu InchI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N